Fully Automatic Wafer Bonder XBS200
Fully automatic wafer bonder for mass production, compatible with various processes for diverse applications such as advanced MEMS, LEDs, and small electronic components.
【Features】 ■ Supports all wafer bonding processes including metal diffusion bonding, eutectic bonding, TLP bonding, adhesive bonding, fusion bonding, anodic bonding, and glass frit bonding. ■ Compatible with wafers and substrates ranging from 100mm to 200mm in diameter, and stacking thicknesses up to 6mm. ■ Achieves high-precision post-bond alignment accuracy through the combination of a high-precision bond aligner module XBS200 and an innovative transport mechanism. ■ Control of the bonding environment through vacuum or gas atmosphere control.
- Company：ズース・マイクロテック
- Price：Other
